Material Properties

Surface Impedances Modeling

Surface Impedances are used to account for limited conductivity of surfaces triangles or assign them dielectric properties. Surface type allows directly assign impedance to the related triangles by defined resistance R and reactance X. Ohmic and Skin types are intended to model the surface impedance of metallic triangles using their material and geometric properties. They are specified by the material conductivity, relative permeability, magnetic loss factor and thickness. Dielectric type allows considering triangles as thin dielectric layer and is specified by relative permittivity, dielectric loss factor and thickness assigned to the related surfaces

  • Assigning Surface Impedances with Constant Parameters
  • Assigning Surface Impedances with Frequency Dependent Parameters

Dielectrics Modeling

Dielectrics feature allows consideration of dielectric media using Surface Integral Equations (SIE) approach. Mixed metallic and dielectric geometries, such as closed dielectric bodies (both ideal and lossy) along with metal/wire geometry, planar structures, consisting of dielectric substrate with metallic traces, and so on can be treated.

  • Assigning Dielectric Properties with Constant Parameters
  • Assigning Dielectric Properties with Frequency Dependent Parameters

  • PEC Ground (metal-dielectric objects can be connected directly to PEC ground plane)
  • Real Ground allows accounting of real material parameters of the ground (permittivity, permeability, dielectric loss factor, magnetic loss factor and conductivity). This feature is based on using the reflection coefficient method to include the ground contributions in matrix elements for arbitrary geometry and excitation.
  • Free Space allows to define surrounding environment parameters
  • Total Power allows to specify the total source power or radiated power of the task to obtain solution with specified total power

Environment properties can be assigned either with constant or frequency dependent parameters.